Proposal ID: 871658
ICCS project ID: 63111000
Role: Partner
Acronym: NEBULA
Topic: ICT-05-2019
Type of action: RIA
Call identifier: H2020-ICT-2018-2020

NEBULA: Neuro-augmented 112Gbaud CMOS plasmonic transceiver platform for Intra- and Inter-DCI applications

Duration in months: 36
Fixed keyword 1: Photonic integration, photonic integrated circuits
Fixed keyword 2: Photonic devices
Fixed keyword 3: Photonics in computing, interconnects, data storage
Free keywords: Co-packaged optics, System in package, System on chip, Photonic Neuromorphic Processing, Reservoir Compunting, CMOS Plasmonics, Silicon Nitride

NEBULA aims to provide the foundations for a common future-proof transceiver technology platform with ultra-high bandwidth capabilities offered by a CMOS compatible toolkit and tailored towards meeting performance, cost and energy metrics in both inter-DCI coherent and intra-DCI ASIC co-packaged optics. NEBULA will be investing in the established bandwidth- and energy saving credentials of plasmonic modulator solutions together with the functional digital processing portfolio of neuromorphic optical reservoir computing engines towards painting the landscape of the next-coming disruption in transceiver evolution, tailoring them in System-in-Package prototype assemblies that can intersect with the challenging framework of both inter- and intra-DCI segments. NEBULA target to demonstrate i) a fully-functional 8-channel 112Gbaud 16QAM C-band transceiver prototype, offering an aggregate capacity of 3.2Tbps and requiring just 2.65W per single 400Gbps wavelength, providing in this way an energy efficiency of only 6.625pJ/bit with energy savings of 93% compared to current 200Gbps and 19W-consuming pluggable optics and ii) a fully-functional sub-Volt 8-channel 112Gbaud PAM4 O-band transmitter co-packaged with a data generating ASIC from Mellanox, offering a 1.6Tbps aggregate capacity with up to 37% energy savings compared to the estimated power requirements of respective Si-photonic-based co-packaged solutions.

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